BLE Tool 1.20 (3)

com.lapis_semi.bleapp.apk, developed by LAPIS Semiconductor Co., Ltd..
Last updated: Sat, 25 Jul 2020 5:38:05 UTC

The BLE Tool provides an easy control for Bluetooth low energy device..

Download BLE Tool 1.20:This version supports environmental sensing profile (ESP) and LAPIS Semiconductor's specific profile (VSP).

BLE Tool File Information

  • Version: 1.20 (3)
  • File size: 2.14 MB
  • Uploaded: Sat, 25 Jul 2020 5:38:05 UTC
  • Minimum Android version: Android 4.3.x and up
  • MD5: d7d71b0e0f414d88cb3bc7cbbc6d8263
  • SHA1: DABD609CD0A550C15FA4FB43FCE31A948F155749
  • Developer: LAPIS Semiconductor Co., Ltd.

Download BLE Tool 1.20 APK 3

ChangeLog

What's new in 1.20 (3) ?
  • This version supports environmental sensing profile (ESP) and LAPIS Semiconductor's specific profile (VSP).
1599062556766.apk
Name:com.lapis_semi.bleapp.apk
Name:D7D71B0E0F414D88CB3BC7CBBC6D8263
Name:com.lapis_semi.bleapp-1.20.apk

Apk scan results


Apk Scaned By TotalVirus Antivirus,com.lapis_semi.bleapp.apk Was Pure And Safe.

Scan Stats:harmless:0|type-unsupported:9|suspicious:0|confirmed-timeout:0|timeout:2|failure:0|malicious:0|undetected:62|
Name:1599062556766.apk
Name:com.lapis_semi.bleapp.apk
Name:D7D71B0E0F414D88CB3BC7CBBC6D8263
Name:com.lapis_semi.bleapp-1.20.apk SHA-1:e205c0baabea7070b18b082c0a5265df118b13cb SHA-256:631c9b46fcfb0510a90747df73396eb23052e7e1b7f6b2cf2f7c27ca595bc282 SSDEEP:49152:uMnz2OkMnz2OI7r03qyhpmDRMnz2O5wp132w2+Aygw/KR:yOAOZqQpaOm2w2ugw/q File type:Android Magic:Zip archive data, at least v2.0 to extract File size:2242048 Uncompressed Size:3401719 Contained Files :197 Contained Files By Type:xml:42,dex:1,MF:1,RSA:1,SF:1,png:150,

Permissions

requires following permissions on your android device.

android.permission.BLUETOOTH
android.permission.BLUETOOTH_ADMIN
android.hardware.bluetooth
android.hardware.faketouch
android.hardware.screen.portrait

Certificate

Certificate Issuer:C:81, CN:Keiichi Chihara, L:Yokohama, O:LAPIS Semiconductor, ST:Kanagawa, OU:Wireless Communication LSI Development Unit
Certificate Subject:C:81, CN:Keiichi Chihara, L:Yokohama, O:LAPIS Semiconductor, ST:Kanagawa, OU:Wireless Communication LSI Development Unit

Activities

com.lapis_semi.bleapp.DevListActivity
com.lapis_semi.bleapp.ProfileActivity
com.lapis_semi.bleapp.ServiceActivity
com.lapis_semi.bleapp.EssCharacteristicActivity

Services

com.lapis_semi.bleapp.BLEService

Interesting Strings

http://www.lapis-semi.com/jp/

Other Versions

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